- Teradyne and MultiLane have announced the signing of an agreement to create a joint venture called MultiLane Test Products (MLTP).
- This new entity aims to meet the growing market demand for data center equipment dedicated to artificial intelligence by accelerating the development of testing solutions for high-speed data interconnects.
- The transaction is expected to close in the first half of 2026, subject to customary closing conditions.
Under this agreement, MultiLane will contribute all assets related to its test and measurement activities to the joint venture. The company will retain its other businesses, including those dedicated to interconnects and data center testing solutions. Teradyne will hold a majority stake in MLTP, while MultiLane will remain a minority shareholder. The joint venture will leverage Teradyne’s international presence in the electronic test equipment market and MultiLane’s expertise in high-speed interface testing instruments. The goal is to develop and offer solutions covering various stages of the value chain, from component-level testing to equipment integrated into data center infrastructures.
This initiative comes at a time of rapid evolution in computing architectures, driven by the increasing need for high-speed interconnects for AI-related applications. The solutions developed by MLTP are designed for the semiconductor, electronic systems, and large-scale computing infrastructure markets.
Teradyne is a supplier of automated test equipment for semiconductors and electronic products, as well as robotic systems for industrial and logistics environments. MultiLane designs and supplies test and measurement solutions for high-speed input/output interfaces, used particularly in the semiconductor, networking and data center sectors.
