- At Embedded World 2026, Anritsu will highlight the importance of RF and signal integrity testing in the development lifecycle of connected devices (IoT).
- The Japanese company will present several demonstrations focusing on Wi-Fi®, Bluetooth®, and 5G RedCap technologies, as well as high-speed signal integrity testing.
- The stated objective is to illustrate how measurement campaigns conducted in the early design phases can identify performance defects and assess their impact before certification or market launch.
Wi-Fi IoT Device RF Performance Testing
The Anritsu MT8862A Wireless Connectivity Test Set will be featured in a demonstration that showcases how device faults can be identified and their effects accurately quantified. The demonstration highlights key RF measurements and explains their significance, emphasising the value of precise testing data. As Wi-Fi technology advances, thorough testing during development and production is vital to maintain reliable performance. The MT8862A (WLAN Tester) is designed for measuring the RF TRx characteristics of WLAN IEEE 802.11a/b/g/n/ac/ax/be devices operating in the 2.4 GHz, 5 GHz, and 6 GHz bands, making it a tool for validating next-generation wireless connectivity.
Reliable Bluetooth® Performance Testing
Anritsu will demonstrate how Bluetooth® RF performance can be accurately measured and analyzed to ensure reliable connectivity. The demo will illustrate the impact of device performance on real-world connectivity, showing how RF testing can help identify potential issues early in the design, validation, or troubleshooting process. Attendees will see how Anritsu solutions provide real-time insights to measure, compare, and optimize Bluetooth® wireless performance.
RedCap Power Consumption Measurement
A dedicated demonstration will showcase how RedCap device power consumption changes under varying conditions within an emulated 5G network environment. Visitors will see why accurate power-consumption testing is essential for IoT devices, as network factors such as signal strength, bandwidth, and modulation can significantly affect real-world battery performance.
The demo will highlight how measuring power across different scenarios helps balance throughput and energy efficiency, verify the behaviour of power-saving features such as eDRX, and prevent costly redesigns by enabling controlled, repeatable testing.
Accelerating High-Speed Signal-Integrity and PCIe Gen6 Compliance Testing
Visitors will experience how high-speed signal-integrity and compliance testing can be streamlined to reduce setup time while maintaining measurement confidence. Anritsu and Teledyne LeCroy will jointly demonstrate a high-performance, multi-standard test solution supporting Ethernet, general-purpose R&D, and PCIe Gen6 compliance.
The live demonstration combines the Anritsu MP1900A Signal Quality Analyzer with the Teledyne LeCroy WaveMaster/SDA 8650HD Oscilloscope, showcasing high-quality PAM4 signal generation and real-time analysis in an integrated workflow.
Attendees will also verify flexibility and rapid reconfiguration to PCIe Gen6 Compliance testing.
Seamless stressed-signal calibration aligned with PCI-SIG guidelines, enabled through full automation using Teledyne-LeCroy’s QualiPhy2 software, will highlight how automation improves repeatability and accelerates time to compliance.
Signal-Integrity Verification and Testing of High-Speed Differential Lines
High-speed differential interconnects are fundamental to modern data center, embedded, and high-performance computing designs, requiring accurate and efficient signal-integrity validation. Anritsu will showcase the ShockLine MS46524B VNA, a 4-port broadband solution up to 43.5 GHz, demonstrated with a GigaProbes differential demo board to highlight real-world interconnect characterization.
Visitors will see how key signal-integrity metrics including differential insertion loss, return loss, and crosstalk can be quickly evaluated, while intuitive low-pass, TDR-like time-domain analysis provides clear insight into impedance discontinuities and interconnect behavior. With integrated fixture extraction and de-embedding tools for both single-ended and differential structures, the MS46524B enables accurate, repeatable SI measurements without external software, streamlining validation of backplanes, cables, connectors, and SERDES interconnects addressing the critical needs of modern data center architectures.
