- Teradyne’s Iris 100 test system targets the electro-optical characterization of MicroLED chips and optoelectronic components, supporting both wafer-level probing and final verification after dicing and assembly.
The Iris 100 platform’s hardware architecture interfaces directly with semiconductor test systems already deployed in foundries and assembly facilities. The primary goal of this integration is to avoid the need for dedicated chassis by adding optical measurement channels directly to the existing test head.
In terms of industrial processing, the platform handles the characterization of MicroLED arrays prior to transfer. The technical roadmap includes the simultaneous integration of photodetector characterization within the same test insertion (single-pass test). Consolidating measurement sequences in this way reduces die-handling cycles and minimizes the risk of contamination or mechanical damage to the micro-scale chips.
Architectures for Photonics and Interconnects
The launch of the Iris 100 tester builds on Teradyne’s ongoing developments in the integrated optics segment. The platform complements the Photon 100 system, introduced earlier in the year for testing silicon photonics (SiPh) integrated circuits and co-packaged optics (CPO) assemblies.
This equipment strategy also leverages the technological integration of the specialist firm Quantifi Photonics, acquired by Teradyne in 2025.
Quantifi Photonics’ optical instrumentation modules enable the combination of high-density optical signal generation and measurement with the traditional electrical parametric test channels found in ATE systems.
